Ka la 9 Phato, Mopresidente oa Amerika Biden o ile a saena "Chip and Science Act", e bolelang hore kamora lilemo tse ka bang tharo tsa tlholisano ea lithahasello, bili ena, e bohlokoa haholo ho nts'etsopele ea indasteri ea tlhahiso ea li-chip tsa malapeng United States, e fetohile molao ka molao.

Bahlabani ba bangata ba indasteri ea semiconductor ba lumela hore mohato ona oa United States o tla potlakisa ts'ebetso ea indasteri ea semiconductor ea China, mme China e ka boela ea sebelisa mekhoa e tsoetseng pele ho sebetsana le eona.

"Chip and Science Act" e arotsoe likarolo tse tharo: Karolo ea A ke "Chip Act ea 2022";Karolo ea B ke "R&D, Competition and Innovation Act";Karolo ea C ke "Molao o Sireletsehileng oa Lichelete oa Lekhotla le ka Holimo-limo oa 2022".

Bili ena e shebane le tlhahiso ea li-semiconductor, e tla fana ka $ 54.2 bilione ho tlatsetso ea lichelete bakeng sa liindasteri tsa semiconductor le seea-le-moea, moo $ 52.7 bilione e reretsoeng indasteri ea semiconductor ea US.Bili e boetse e kenyelletsa mokitlane oa lekhetho oa 25% bakeng sa tlhahiso ea li-semiconductor le lisebelisoa tsa tlhahiso ea li-semiconductor.'Muso oa US o tla boela o fane ka $200 limilione tse likete lilemong tse leshome tse tlang ho ntšetsa pele lipatlisiso tsa saense ho bohlale ba maiketsetso, robotics, quantum computing, le tse ling.

Bakeng sa lik'hamphani tse etellang pele tsa semiconductor ho eona, ho saena ha bili ha ho makatse.Mookameli oa Intel, Pat Gelsinger, o boletse hore bili ea chip e kanna ea ba leano la bohlokoahali la indasteri le hlahisitsoeng ke United States ho tloha Ntoeng ea Bobeli ea Lefatše.